One of the requirements for achieving faster CMOS electronics is to avoid the large chip areas required to steer heat away from or, more recently, towards the critical regions of state-of-the-art devices. Thermal-guiding (TG) structures can efficiently direct heat by ‘meta-materials’ engineering; however, some key aspects of the behavior of these systems are not fully understood. Here, we control the thermal-transport properties of TG structures by using nanometer-size, CMOS-friendly, graphene-on-silica (GOS) stacked materials through advanced computer simulations. It has been shown that it is possible to achieve new, controllable, thermally-based Boolean-logic and neural-network operations for brain-like computing applications using such thermal-guide systems.
D. Loke, J. M. Skelton, T. C. Chong, S. R. Elliott. Design of a Nanoscale, CMOS-Integrable, Thermal-Guiding Structure for Boolean-Logic and Neuromorphic Computation. ACS Appl. Mater. Interfaces (2016). DOI: 10.1021/acsami.6b10667
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